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The modern production facility of Epotek is designed to achieve breakthroughs in top efficiency. The competitive advantages of Epotek lie in transferring lower cost, higher production efficiency, and lower defects into customer savings.

Epotek devotes to deliver higher quality products at lower cost because customer priority and customer satisfaction are the main motto of Epotek. Epotek has long term contracts with air courier company such as FedEx,
UPS and DHL etc, provide our customers the soonest delivery and the cheapest transportation charge.

Rigid PCB Capability

Technology Description
Plant 1
Plant 2

Minimum Trace/Space (Outer Layer)
Minimum Trace/Space (Inner Layer)
Minimum Finished Hole
Min. Thin Board Thickness 4L
Min. Thin Board Thickness 6L
Minimum / Maximum Layer Count
Board Flatness Tolerance
Minimum SMT Device Pitch
Impendence Control Tolerance

3/3mil
2.5/2.5mil
0.20mm
0.4mm
0.6mm
2/18
0.5%
10mil
¡Ó10%

6/6mil
5/5mil
0.35mm
1.0mm
1.2mm
1/6
0.5%
10mil
¡Ó 10%

Flex PCB Capability

Technology Description

Technical Parameter

Minimum Trace/Space (Outer Layer)
Minimum Trace/Space (Inner Layer)
Minimum Finished Hole
Polyester thickness
Polymide thickness
Minimum / Maximum Layer Count
Flexural Strength
ED-copper Foil
Impendence Control Tolerance

3/3mil
2/2mil
0.2mm
.012.015.025.050mm
.012.015.025.050mm
1-6L
IPC standard
11, 18, 35, 70, 100um
¡Ó10%

¡@

 

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* Electronica India and Productronica India 2009
Date: 8 SEP 2009- 11 SEP 2009
Stall No. Hall 2 2242

*Taitronics Taipei Taiwan
Date: 8 OCT 2009- 11 OCT 2009
Stall No. TWTC Nangang Exhibition Hall J1209-J1211

*Nepcon World Japan
Date: 20 JAN 2010- 22 JAN 2010