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2-layer PCB Board with FR4 Laminate |
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Laminate: FR4 tg140
Board thickness: 1.6mm (.062 inch)
Copper thickness: 35£gm (1oz) copper for all layers after finish
Copper wall in the hole: 25.4£gm (1 mil)
Solder resist: SMOBC bright red/ bright black/ white
Finish:
ENIG
Trace width/width: 0.152/0.152mm (6/6 mil)
Minimum hole size: 0.3mm ( 11.8mil)
IPC class 3 standard |
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4-layer PCB with FR4 Laminate and 1.6mm Board Thickness |
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Laminate: FR4
Board thickness: 1.6mm (.062-inch)
Copper thickness: 35um (1oz) copper for all layers after finish
Copper wall in the hole: 20um (0.8 mil)
Solder resist: SMOBC
Finish:
Immersion gold Ni: 3 to 5um
Au: 0.05um (Ni: 120 micro inch/Au: 2 micro inch)
Trace width/width: 0.15/0.15mm (6/6 mil) |
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4 -layer Flex PCB with Polymide Laminate |
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Laminate: polymide
Board thickness: 0.2mm (5-inch)
Copper thickness: 35um (1oz) copper for all layers after finish
Copper wall in the hole: 20um (0.8 mil)
Coverlay: 25um (1 mil)
Finish:
Immersion gold Ni: 3 to 5um
Au: 0.05um (Ni: 120 micro inch/Au: 2 micro inch)
Trace width/width: 0.15/0.15mm (6/6 mil)
Minimum hole size: 0.3mm (12 mil) |
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8-layer PCBA Industrial Motherboard with FR4 Laminate |
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Laminate: FR4
Board thickness: 1.6mm (.062 inch)
Copper thickness: 35um (1oz) copper for all layers after finish
Copper wall in the hole: 25um (1 mil)
Solder resist: SMOBC
Finish:
Immersion gold Ni: 3 to 5um
Au: 0.05um (Ni: 120 micro inch/Au: 2 micro inch)
Trace width/width: 0.1/0.1mm (4/4 mil)
Minimum hole size: 0.1mm (4 mil)
IPC class 3 standard |
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26-layer PCB-IC Load Board with FR4 Laminate |
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Laminate: FR4
Board thickness: 4.0mm (.158 inch)
Copper thickness: 35um (1oz) copper for all layers after finish
Copper wall in the hole: 25um (1 mil)
Solder resist: SMOBC
Finish:
Immersion gold Ni: 3 to 5um
Au: 0.05um (Ni: 120 micro inch/Au: 2 micro inch)
Trace width/width: 0.15/0.15mm (6/6 mil)
Minimum hole size: 0.8mm (31.5 mil)
IPC class 3 standard |
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4-layer Rigid-flex PCB with SMOBC Solder Resistance |
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Laminate: FR4 + Kapton
Board thickness: 1.6mm (.062-inch)
Copper thickness: 35um (1oz) copper for all layers after finish
Copper wall in the hole: 20um (0.8 mil)
Solder resist: SMOBC
Finish:
Immersion gold Ni: 3 to 5um
Au: 0.05um (Ni: 120m micro inch/Au:2 micro inch)
Trace width/width: 0.15/0.15mm (6/6 mil) |
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2-layer PCB Board with FR4 Lamination and HASL Finish |
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Laminate: FR4 tg140
Board thickness: 1.6mm (.062-inch)
Copper thickness: 35um (1oz) copper for all layers after finish
Copper wall in the hole: 25.4um (1mil)
Solder resist: SMOBC white
Finish: HASL
Trace width/width: 0.203/0.178mm (8/7mil)
Minimum hole size: 0.45mm (17.7mil)
IPC class 3 standard |
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12-layer PCB Board with ISO410 Lamination |
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Laminate: IS410
Board thickness: 1.52mm (.059-inch)
Copper thickness: 52.5um (1.5oz) copper for all layers after finish
Copper wall in the hole: 25.4um (1mil)
Solder resist: SMOBC bright blue
Finish: ENIG
Trace width/width: 0.127/0.127mm (5/5mil)
Minimum hole size: 0.3mm (11.8mil)
IPC class 2 standard |
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